線路板層數　 ≤20 Layers　　

孔徑誤差值 NPTH:±0.05mm (± 2mils)

Hole Size Tolerance PTH:±0.075mm (± 3mils)

最小線經/線距(H/H) 0.075mm (3mils)

Min. Trace/Space (H/H)

最小SMD間距/墊寬 0.2mm (8mils)

 Min. SMD Space/ Land Width

最小線經/線距(1/1 2/2) 0.15mm (6mils)

Min. Trace/Space(1/1 2/2)

最大板尺寸 530mmx620mm (21"x24.4")

Max. Panel Size

最小孔經 0.15mm (6mils)

Min. Hole Size (Before Plating)

縱橫比 8:1

Aspect Ratio

各層通孔對准度 0.05mm (2mils)

Registration Between Layers Tolerance

薄板能力 0.3mm (12mils)

Min. Thickness Board

防焊誤差值 0.05mm (2.0mils)

Solder Mask Tolerance

厚板能力 3.2mm (126mils)

Max. Heavy Board

防焊條 0.1mm (4mils)

Min. Solder Dam

成型尺寸精度 ± 0.15mm (±6mils)

Outline Dimension Tolerance

表面處理:OSP 、無鉛噴錫、化银、化锡、鍍(化)金

Sunface Treatment :OSP、Lead Free HAL、Immersion Ag、Immersion Sn、Plating (Immersion)Gold